MIL-DTL-27723F
4.6.21 Humidity. The probe shall be subjected to a humidity test in accordance with
method 507 of MIL-STD-810. The probe shall then be air dried for 1 hour after which a
potential of 100V DC shall be applied between any electrical pin contacts of the temperature-
sensing element (pin C or D) to any ground part of the probe. The resistance measured shall be
greater than 10 megohms. A potential of 500V rms 60 Hz shall be applied between any electrical
pin contact of the deicing heater element (pin B or F) and any ground part of the probe. The
resistance measured shall be greater than 1 megohms. The resistance of the temperature-sensing
element shall be determined at 0°C and 100°C and shall not differ from the resistance values
before the test by more than the equivalent of 0.2°C.
4.6.22 Thermal shock. The probe shall be subjected to a temperature of 0±5°C for a
period of 30 minutes. It shall be removed from this medium and within 15 seconds subjected to
a temperature of 200±5°C for a period of 30 minutes. The probe shall then be removed from this
medium and within 15 seconds, re-subjected to a temperature of 0°C. This thermal cycle shall be
repeated 8 times. No visible damage to the probe shall result. The resistance of the temperature-
sensing element shall then be determined at 0°C and 100°C and shall not differ by more than the
equivalent of 0.2°C from the resistance value before the test.
4.6.23 Salt fog. The probe shall be subjected to a salt fog test in accordance with method
509 of MIL-STD-810. No damage shall result from this test which will affect subsequent
operations of the probe.
4.6.24 Fungus. The probe shall be subjected to a fungus test in accordance with method
508 of MIL-STD-810. No damage shall result from this test which will affect subsequent
operations of the probe.
4.6.25 Sand and dust. The probe shall be subjected to a sand and dust test in accordance
with method 510 of MIL-STD-810. No damage shall result from this test which will affect
subsequent operations of the probe.
5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as
specified in the contract or order (see 6.2). When packaging of materiel is to be performed by
DoD or in-house contractor personnel, these personnel need to contact the responsible packaging
activity to ascertain packaging requirements. Packaging requirements are maintained by the
Inventory Control Point's packaging activities within the Military Service or Defense Agency, or
within the military service's system commands. Packaging data retrieval is available from the
managing Military Department's or Defense Agency's automated packaging files, CD-ROM
products, or by contacting the responsible packaging activity.
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